Invention Grant
- Patent Title: High modulus epoxy adhesives for shimming applications
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Application No.: US14900895Application Date: 2014-06-26
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Publication No.: US10059862B2Publication Date: 2018-08-28
- Inventor: Sohaib Elgimiabi , Frans A. Audenaert
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee: 3M INNOVATIVE PROPERTIES COMPANY
- Current Assignee Address: US MN St. Paul
- Agent Philip P. Soo
- Priority: EP13174287 20130628
- International Application: PCT/US2014/044318 WO 20140626
- International Announcement: WO2014/210298 WO 20141231
- Main IPC: C09J163/04
- IPC: C09J163/04 ; C09J163/00 ; C08G59/56 ; C08L63/00 ; B32B7/12

Abstract:
Use of a curable composition comprising at least one epoxy resin and at least one epoxy curative composition as a curable shim for filling gaps between two assembled parts of an assembly, wherein the epoxy curative composition comprises at least a first and a second curative wherein the first curative is selected from a cyclic amine having at least one primary amino (—NH2) group and a second curative selected from at least one polyether polyamine comprising at least one polyether unit and separated therefrom by a linking group at least one polyamine unit and further comprising at least one terminal aminoalkyl residue that is branched and comprises a primary amino group (—NH2) and an alkyl branch in an α-, β- or γ-position to the primary amino group wherein the alkyl branch contains from 1 to 6 carbon atoms.
Public/Granted literature
- US20160152879A1 HIGH MODULUS EPOXY ADHESIVES FOR SHIMMING APPLICATIONS Public/Granted day:2016-06-02
Information query
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