High modulus epoxy adhesives for shimming applications
Abstract:
Use of a curable composition comprising at least one epoxy resin and at least one epoxy curative composition as a curable shim for filling gaps between two assembled parts of an assembly, wherein the epoxy curative composition comprises at least a first and a second curative wherein the first curative is selected from a cyclic amine having at least one primary amino (—NH2) group and a second curative selected from at least one polyether polyamine comprising at least one polyether unit and separated therefrom by a linking group at least one polyamine unit and further comprising at least one terminal aminoalkyl residue that is branched and comprises a primary amino group (—NH2) and an alkyl branch in an α-, β- or γ-position to the primary amino group wherein the alkyl branch contains from 1 to 6 carbon atoms.
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