Rapid curing epoxy adhesive compositions

    公开(公告)号:US10882947B2

    公开(公告)日:2021-01-05

    申请号:US15301126

    申请日:2015-06-17

    发明人: Sohaib Elgimiabi

    IPC分类号: C08G59/50 C08G59/68 C08K7/28

    摘要: The present disclosure is directed to a curable composition comprising: a) an epoxy resin; b) an epoxy curing agent comprising at least one cycloaliphatic amine; c) at least 3 wt % of a metal triflate catalyst; d) optionally, a fatty acid polyamide; and e) optionally, a filler material. The compositions of the present disclosure are particularly suitable for use in structural assembly, in particular for potting and filling operations in sandwich structures. The present disclosure also relates to a composite assembly and to methods of using such epoxy resin based curable compositions.

    LOW DENSITY EPOXY COMPOSITION WITH LOW WATER UPTAKE
    7.
    发明申请
    LOW DENSITY EPOXY COMPOSITION WITH LOW WATER UPTAKE 审中-公开
    低吸水率的低密度环氧组合物

    公开(公告)号:US20150118480A1

    公开(公告)日:2015-04-30

    申请号:US14395394

    申请日:2013-04-15

    发明人: Sohaib Elgimiabi

    IPC分类号: C09D163/00 C09D7/12

    摘要: A curable composition comprising (i) at least one aromatic epoxy resin; (ii) at least one curing agent for curing the aromatic epoxy resin said curing agent comprising at least one cycloaliphatic amine; (iii) at least one fatty acid polyamide having a melting point of from 100° C. to 145° C., wherein the fatty acid polyamide contains at least two end-groups according to the formula (I) —NRa—CO—Rb wherein Ra represents H or an alkyl group having from 1 to 4 carbon atoms and Rb represents a saturated or unsaturated alkyl chain containing from 3 to 27 carbon atoms; and (iv) at least one filler material comprising hollow particles. Also provided are cured compositions comprising the reaction product of a curing reaction of the curable compositions, coating comprising the curable compositions and methods of coating the exterior surface of articles using the curable compositions.

    摘要翻译: 一种可固化组合物,其包含(i)至少一种芳族环氧树脂; (ii)至少一种用于固化芳族环氧树脂的固化剂,所述固化剂包含至少一种脂环族胺; (iii)至少一种熔点为100℃至145℃的脂肪酸聚酰胺,其中所述脂肪酸聚酰胺含有至少两个根据式(I)的端基-NR a -CO-R b 其中Ra表示H或具有1至4个碳原子的烷基,Rb表示含有3至27个碳原子的饱和或不饱和烷基链; 和(iv)至少一种包含中空颗粒的填料。 还提供了包含可固化组合物的固化反应的反应产物,包含可固化组合物的涂层和使用可固化组合物涂覆制品的外表面的方法的固化组合物。

    ROOM TEMPERATURE STABLE ONE-PART VOID FILLER

    公开(公告)号:US20220017684A1

    公开(公告)日:2022-01-20

    申请号:US17295907

    申请日:2019-12-10

    摘要: A curable void filler composition comprising at least one epoxy resin; at least one epoxy curing agent comprising at least one bicyclic carboxylic acid anhydride; and at least one epoxysilane compound according to formula (1), where formula (1) is Glycidoxy-R1Si(OR2)(OR3)(OR4), and R1 is selected from linear or branched alkyl comprising from 1 and 15 carbon atoms; and R2, R4 and R4 may be different or the same, and are independently selected from linear or branched alkyl comprising from 2 to 15 carbon atoms.