Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
-
Application No.: US15643488Application Date: 2017-07-07
-
Publication No.: US10062604B2Publication Date: 2018-08-28
- Inventor: Ching-Yu Chang , Ssu-I Fu , Yu-Hsiang Hung , Chih-Kai Hsu , Wei-Chi Cheng , Jyh-Shyang Jenq
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201610292063 20160505
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/768 ; H01L29/423 ; H01L21/02 ; H01L21/311 ; H01L21/8234 ; H01L27/088 ; H01L21/28 ; H01L21/8238 ; H01L23/485

Abstract:
A semiconductor device includes: a substrate, a gate structure on the substrate, and a spacer adjacent to the gate structure, in which the spacer extends to a top surface of the gate structure, a top surface of the spacer includes a planar surface, the spacer encloses an air gap, and the spacer is composed of a single material. The gate structure includes a high-k dielectric layer, a work function metal layer, and a low resistance metal layer, in which the high-k dielectric layer is U-shaped. The semiconductor device also includes an interlayer dielectric (ILD) layer around the gate structure and a hard mask on the spacer, in which the top surface of the hard mask is even with the top surface of the ILD layer.
Public/Granted literature
- US20170323824A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2017-11-09
Information query
IPC分类: