- 专利标题： Integrated fan-out package structures with recesses in molding compound
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申请号： US14858530申请日： 2015-09-18
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公开(公告)号： US10062662B2公开(公告)日： 2018-08-28
- 发明人: Po-Hao Tsai , Li-Hui Cheng , Jui-Pin Hung , Jing-Cheng Lin
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/56 ; H01L23/538 ; H01L21/683 ; H01L21/3105 ; H01L21/311 ; H01L21/78 ; H01L23/31
摘要：
A package includes a first die and a second die. The first die includes a first substrate and a first metal pad overlying the first substrate. The second die includes a second substrate and a second metal pad overlying the second substrate. A molding compound molds the first die and the second die therein. The molding compound has a first portion between the first die and the second die, and a second portion, which may form a ring encircles the first portion. The first portion and the second portion are on opposite sides of the first die. The first portion has a first top surface. The second portion has a second top surface higher than the first top surface.
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