Invention Grant
- Patent Title: Support supply apparatus and method for supplying support
-
Application No.: US15219930Application Date: 2016-07-26
-
Publication No.: US10065808B2Publication Date: 2018-09-04
- Inventor: Masakatsu Ohno , Kohei Yokoyama , Satoru Idojiri , Hisao Ikeda , Yasuhiro Jinbo , Hiroki Adachi , Yoshiharu Hirakata , Shingo Eguchi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2013-179700 20130830; JP2014-029405 20140219
- Main IPC: B32B38/10
- IPC: B32B38/10 ; B65G49/06 ; H01L51/52 ; H01L51/56 ; B32B17/06 ; B32B37/00 ; B32B43/00 ; B65H3/08 ; B65H3/48 ; B65H16/00 ; B65H35/00 ; H01L27/32 ; H01L21/68 ; H01L21/673 ; H01L21/677

Abstract:
An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
Public/Granted literature
- US20160332826A1 SUPPORT SUPPLY APPARATUS AND METHOD FOR SUPPLYING SUPPORT Public/Granted day:2016-11-17
Information query