Invention Grant
- Patent Title: MEMS device and manufacturing method thereof
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Application No.: US15275976Application Date: 2016-09-26
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Publication No.: US10065852B2Publication Date: 2018-09-04
- Inventor: Chun-Wen Cheng , Chia-Hua Chu , Ming-Dao Wu , Tzu-Heng Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: B81B3/00
- IPC: B81B3/00 ; B81C1/00 ; H04R19/00

Abstract:
A MEMS device includes a substrate, a supporter, a first back plate, a second back plate and a diaphragm. The substrate has a cavity. The supporter is over the substrate. The first back plate is over the cavity and fixed on the supporter. The second back plate is over the cavity and fixed on the supporter. The diaphragm is between the first back plate and the second back plate. The diaphragm includes a first sub-diaphragm and a second sub-diaphragm over the cavity and fixed on the supporter.
Public/Granted literature
- US20180086624A1 MEMS DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-03-29
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