Invention Grant
- Patent Title: Methods and apparati for making thin semi-conductor wafers with locally controlled regions that are relatively thicker than other regions and such wafers
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Application No.: US15306787Application Date: 2015-04-17
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Publication No.: US10072351B2Publication Date: 2018-09-11
- Inventor: Emanuel M. Sachs , Ralf Jonczyk , Adam L. Lorenz , Richard L. Wallace , G. D. Stephen Hudelson
- Applicant: 1366 TECHNOLOGIES, INC.
- Applicant Address: US MA Bedford
- Assignee: 1366 Technologies, Inc.
- Current Assignee: 1366 Technologies, Inc.
- Current Assignee Address: US MA Bedford
- Agent Steven J. Weissburg
- International Application: PCT/US2015/026389 WO 20150417
- International Announcement: WO2015/167826 WO 20151105
- Main IPC: H01L29/06
- IPC: H01L29/06 ; C30B11/02 ; C30B29/06 ; H01L31/0224 ; H01L31/028 ; H01L31/0352 ; H01L31/068 ; H01L31/18

Abstract:
Semi-conductor wafers with thin and thicker regions at controlled locations may be for Photovoltaics. The interior may be less than 180 microns or thinner, to 50 microns, with a thicker portion, at 180-250 microns. Thin wafers have higher efficiency. A thicker perimeter provides handling strength. Thicker stripes, landings and islands are for metallization coupling. Wafers may be made directly from a melt upon a template with regions of different heat extraction propensity arranged to correspond to locations of relative thicknesses. Interstitial oxygen is less than 6×1017 atoms/cc, preferably less than 2×1017, total oxygen less than 8.75×1017 atoms/cc, preferably less than 5.25×1017. Thicker regions form adjacent template regions having relatively higher heat extraction propensity; thinner regions adjacent regions with lesser extraction propensity. Thicker template regions have higher extraction propensity. Functional materials upon the template also have differing extraction propensities.
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