Invention Grant
- Patent Title: Light-emitting device with flexible substrates
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Application No.: US15810249Application Date: 2017-11-13
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Publication No.: US10079353B2Publication Date: 2018-09-18
- Inventor: Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2014-029756 20140219
- Main IPC: H01L51/00
- IPC: H01L51/00 ; B32B37/02 ; B32B37/10 ; B32B37/18
Abstract:
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Public/Granted literature
- US20180076401A1 LIGHT-EMITTING DEVICE AND PEELING METHOD Public/Granted day:2018-03-15
Information query
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