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公开(公告)号：US20160347047A1
公开(公告)日：2016-12-01
申请号：US15165099
申请日：2016-05-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Saki Eguchi , Koichi TAKESHIMA , Hiroki ADACHI
IPC: B32B43/00 , H01L21/683
CPC classification number: B32B43/006 , B32B37/003 , B32B37/22 , B32B38/10 , B32B2457/14 , B32B2457/20 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
Abstract translation: 提高分离过程中的产率。 提供了一种能够在大面积基板中容易分离的分离装置。 分离装置具有将处理构件分割成第一构件和第二构件的功能，并且包括支撑体供给单元，支撑体保持单元，转移机构，方向改变机构和结构体。 结构体将支撑体结合到第一构件的表面。 当处理构件的至少一部分位于方向改变机构和结构体或压力施加机构之间时，方向改变机构与包括第一构件的表面的第一平面之间的最短距离比最短距离 在第一平面和结构体或压力施加机构之间。
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Patent Agency Ranking
公开(公告)号：US09849660B2
公开(公告)日：2017-12-26
申请号：US15165099
申请日：2016-05-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Saki Eguchi , Koichi Takeshima , Hiroki Adachi
CPC classification number: B32B43/006 , B32B37/003 , B32B37/22 , B32B38/10 , B32B2457/14 , B32B2457/20 , H01L21/67132 , H01L21/6836 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68381 , H01L2221/68386 , H01L2221/6839 , H01L2221/68395
Abstract: A yield in a separation process is improved. A separation apparatus which enables easy separation in a large-area substrate is provided. The separation apparatus has a function of dividing a process member into a first member and a second member and includes a support body supply unit, a support body hold unit, a transfer mechanism, a direction changing mechanism, and a structure body. The structure body bonds a support body to a surface of the first member. When at least part of the process member is located between the direction changing mechanism and the structure body or the pressure applying mechanism, the shortest distance between the direction changing mechanism and a first plane including the surface of the first member is longer than the shortest distance between the first plane and the structure body or the pressure applying mechanism.
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公开(公告)号：US09676175B2
公开(公告)日：2017-06-13
申请号：US14740957
申请日：2015-06-16
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Hiroki Adachi , Saki Eguchi , Masakatsu Ohno , Junpei Yanaka , Yoshiharu Hirakata
IPC: B32B43/00 , H01L21/67 , B32B37/12 , B32B37/22 , B32B38/10 , B32B38/18 , B32B39/00 , H01L21/683 , B32B37/00
CPC classification number: B32B43/006 , B32B37/003 , B32B37/025 , B32B37/12 , B32B37/187 , B32B37/22 , B32B38/10 , B32B38/18 , B32B39/00 , B32B2457/00 , B32B2457/20 , B32B2457/208 , H01L21/67132 , H01L21/6835 , H01L2221/68318 , H01L2221/6835 , H01L2221/68363 , H01L2221/68386 , Y10T156/195
Abstract: A peeling apparatus including a support body supply unit, a support body hold unit, a transfer mechanism, and a first structure body. The first structure body has a convex surface. The support body supply unit has a function of unwinding a first support body and includes one of a pair of tension applying mechanisms. The support body hold unit includes the other of the pair of tension applying mechanisms. The pair of tension applying mechanisms applies tension to the first support body. The transfer mechanism has a function of transferring a process member. The first structure body has a function of bending back the first support body along the convex surface. The first structure body has a function of dividing the process member into a first member and a second member. An angle at which the first structure body bends back the first support body is an obtuse angle.
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公开(公告)号：US09437832B2
公开(公告)日：2016-09-06
申请号：US14621914
申请日：2015-02-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
IPC: H01L51/00 , B32B7/02 , B32B38/10 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/02 , B32B37/18 , B32B37/12 , H01L51/52
CPC classification number: H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Abstract translation: 提供了灵活的设备。 柔性装置的粘合层的硬度设定为高于70°的肖氏D值，或优选高于或等于邵氏D的80°。挠性装置的柔性基板的膨胀系数设定得较小 比58ppm /℃，或优选小于或等于30ppm /℃
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公开(公告)号：US10141526B2
公开(公告)日：2018-11-27
申请号：US15252295
申请日：2016-08-31
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
IPC: H01L51/00 , B32B7/02 , B32B37/02 , B32B37/18 , B32B38/10 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B27/20 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B7/06 , B32B17/06 , B32B37/10 , B32B37/12 , H01L51/52
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
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公开(公告)号：US10079353B2
公开(公告)日：2018-09-18
申请号：US15810249
申请日：2017-11-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor： Tatsuya Sakuishi , Yutaka Uchida , Hiroki Adachi , Saki Eguchi , Junpei Yanaka , Kayo Kumakura , Seiji Yasumoto , Kohei Yokoyama , Akihiro Chida
CPC classification number: H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
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