Interposer socket includes a base substrate and a plurality of spring contacts coupled to the base substrate. Each of the spring contacts has an inclined section that extends away from a top side of the base substrate at a generally non-orthogonal orientation. The inclined section configured to be deflected toward the top side when an electronic module is mounted onto the interposer socket. The inclined section has a mating surface of the spring contact that is configured to engage the electronic module. The inclined section also includes first and second beam segments and a contact slot therebetween. The first and second beam segments extend in an oblique direction away from the top side. The contact slot has a slot width that is defined between inner edges of the first and second beam segments. The slot width increases as the contact slot extends in the oblique direction.