Invention Grant
- Patent Title: Heat exchange system, and substrate processing apparatus having same
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Application No.: US14591107Application Date: 2015-01-07
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Publication No.: US10081033B2Publication Date: 2018-09-25
- Inventor: Satoshi Kaneko , Kazuki Motomatsu
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-001608 20140108
- Main IPC: B05C11/10
- IPC: B05C11/10 ; H01L21/67

Abstract:
A heat exchange system 62 includes heat exchangers 69a and 69b that heat or cool a fluid passing therethrough; a fluid supply unit 81 that supplies the heating target fluid or the cooling target fluid into lower portions thereof; and a fluid discharge unit 82 that discharges the heated fluid or the cooled fluid from upper portions thereof. The fluid supply unit includes inlet lines 85 and 86 through which the fluid is introduced; a first manifold 87 located above the upper end portion of the heat exchangers and connected with the inlet lines; a gas exhaust line 88 that is connected to the first manifold and exhausts a gas mixed in the fluid; a supply line 89 that supplies the fluid from the first manifold. While passing through the heat exchangers from the lower portions toward the upper portions thereof, the fluid is heated or cooled.
Public/Granted literature
- US20150190838A1 HEAT EXCHANGE SYSTEM, AND SUBSTRATE PROCESSING APPARATUS HAVING SAME Public/Granted day:2015-07-09
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