- Patent Title: Slim imager, associated system-in-package, and associated method
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Application No.: US15095585Application Date: 2016-04-11
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Publication No.: US10082651B2Publication Date: 2018-09-25
- Inventor: Teng-Sheng Chen , Jau-Jan Deng , Wei-Feng Lin
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop Gage LLP
- Main IPC: H04N5/225
- IPC: H04N5/225 ; G02B13/00 ; G01J1/02 ; H01L31/0203

Abstract:
In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.
Public/Granted literature
- US20170293115A1 Slim Imager, Associated System-In-Package, And Associated Method Public/Granted day:2017-10-12
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