Light-shielded cameras and methods of manufacture

    公开(公告)号:US11063083B2

    公开(公告)日:2021-07-13

    申请号:US16600180

    申请日:2019-10-11

    Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.

    Notched-Spacer Camera Module And Method For Fabricating Same

    公开(公告)号:US20170111560A1

    公开(公告)日:2017-04-20

    申请号:US14884390

    申请日:2015-10-15

    CPC classification number: H04N5/2257 H04N5/2253

    Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.

    Notched-spacer camera module and method for fabricating same

    公开(公告)号:US10187560B2

    公开(公告)日:2019-01-22

    申请号:US14884390

    申请日:2015-10-15

    Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.

    Image sensor devices and methods for manufacturing the same
    7.
    发明授权
    Image sensor devices and methods for manufacturing the same 有权
    图像传感器装置及其制造方法

    公开(公告)号:US08941202B2

    公开(公告)日:2015-01-27

    申请号:US14019333

    申请日:2013-09-05

    Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.

    Abstract translation: 提供了一种用于形成图像传感器装置的方法。 首先,设置透镜并在其上形成第一牺牲元件。 在透镜和第一牺牲元件上形成电磁干涉层,并且去除其上的第一牺牲元件和电磁干涉层以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域。 透镜的选定部分的外围区域保持暴露。 在透镜的选定部分的电磁干涉图案,第二牺牲元件和周边区域上形成遮光层。 去除第二牺牲元件和遮光图案以将透镜的所选部分的中心区域作为透光区域。

    Endoscope tip assembly using truncated trapezoid cavity interposer to allow coplanar camera and LEDs in small-diameter endoscopes

    公开(公告)号:US12251081B2

    公开(公告)日:2025-03-18

    申请号:US17747803

    申请日:2022-05-18

    Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

    Interposer and chip-scale packaging for wafer-level camera

    公开(公告)号:US10734437B2

    公开(公告)日:2020-08-04

    申请号:US16267370

    申请日:2019-02-04

    Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.

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