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公开(公告)号：US11172806B2
公开(公告)日：2021-11-16
申请号：US16796087
申请日：2020-02-20
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Feng Lin , Xiang-Dong Xiong
Abstract: A novel endoscope includes a camera module, an electrical cable, and an electrical connector. The camera module includes an analog image signal output terminal. The cable includes an analog image signal line having a first end connected to the analog image signal output terminal of the camera module. The electrical connector includes a set of electrical contacts configured to engage a complimentary set of electrical contacts of a host system. The set of electrical contacts includes at least an analog image signal contact connected to a second end of the analog image signal line of the cable.
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公开(公告)号：US11063083B2
公开(公告)日：2021-07-13
申请号：US16600180
申请日：2019-10-11
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Ying Chung , Chen-Yu Hung
IPC: H01L31/0232 , H01L27/146
Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.
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公开(公告)号：US20170293115A1
公开(公告)日：2017-10-12
申请号：US15095585
申请日：2016-04-11
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Jau-Jan Deng , Wei-Feng Lin
CPC classification number: G02B13/0085 , G01J1/0204 , G01J1/0403 , G01J1/0411 , G01J1/4228 , H04N5/2252 , H04N5/2253 , H04N5/2254
Abstract: In an embodiment, a slim imager is disclosed. The slim imager includes a substrate including an aperture, an image sensor, and an optics unit. The image sensor is on a bottom side of the substrate, spans the aperture, and has an aperture-facing top surface. The optics unit is on a top side of the substrate, spans the aperture, and includes a transmissive optical element having an aperture-facing bottom surface. A volume partially bound by the aperture-facing top surface and the aperture-facing bottom surface has a refractive index less than 1.01 at visible wavelengths.
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公开(公告)号：US20170111560A1
公开(公告)日：2017-04-20
申请号：US14884390
申请日：2015-10-15
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC: H04N5/225
CPC classification number: H04N5/2257 , H04N5/2253
Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
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公开(公告)号：US12064090B2
公开(公告)日：2024-08-20
申请号：US17504105
申请日：2021-10-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Jau-Jan Deng , Wei-Feng Lin , Chun-Sheng Fan
CPC classification number: A61B1/051 , A61B1/00096 , A61B1/0638 , A61B1/0684
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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Patent Agency Ranking
公开(公告)号：US10187560B2
公开(公告)日：2019-01-22
申请号：US14884390
申请日：2015-10-15
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC: H04N5/225
Abstract: A notched-spacer camera module includes a chip-scale package, a lens plate, a spacer ring, and a glue ring. The chip-scale package has an image sensor and a top surface. The spacer ring includes a glue gate having a gate height and a spacer base, having a base height, between the glue gate and the lens plate. The glue ring is between the spacer ring and the top surface and has (i) an outer region between the top surface and a bottom surface of the spacer base, and (ii) an inner region, having an inner thickness, between the top surface and a bottom surface of the glue gate. The lens plate, the spacer ring, the glue ring, and the top surface form a sealed cavity having a cavity height equal to at least a sum of the inner thickness, the gate height, and the base height.
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公开(公告)号：US08941202B2
公开(公告)日：2015-01-27
申请号：US14019333
申请日：2013-09-05
Inventor： Ming-Kai Liu , Tzu-Wei Huang , Jui-Hung Chang , Chia-Hui Huang , Teng-Sheng Chen
IPC: H01L31/0232 , H01L31/0216 , H01L27/146 , H01L31/18
CPC classification number: H01L31/0232 , H01L27/14623 , H01L27/14627 , H01L27/14685 , H01L31/0216 , H01L31/02164 , H01L31/02165
Abstract: A method for forming an image sensor device is provided. First, a lens is provided and a first sacrificial element is formed thereon. An electromagnetic interference layer is formed on the lens and the first sacrificial element, and the first sacrificial element and electromagnetic interference layer thereon are removed to form an electromagnetic interference pattern having an opening exposing a selected portion of the lens. A second sacrificial element is formed in the opening to cover a center region of the selected portion of the lens. A peripheral region of the selected portion of the lens remains exposed. A light-shielding layer is formed on the electromagnetic interference pattern, second sacrificial element, and peripheral region of the selected portion of the lens. The second sacrificial element and light-shielding pattern are removed to expose the center region of the selected portion of the lens as a light transmitting region.
Abstract translation: 提供了一种用于形成图像传感器装置的方法。 首先，设置透镜并在其上形成第一牺牲元件。 在透镜和第一牺牲元件上形成电磁干涉层，并且去除其上的第一牺牲元件和电磁干涉层以形成具有暴露透镜的选定部分的开口的电磁干涉图案。 第二牺牲元件形成在开口中以覆盖透镜的所选部分的中心区域。 透镜的选定部分的外围区域保持暴露。 在透镜的选定部分的电磁干涉图案，第二牺牲元件和周边区域上形成遮光层。 去除第二牺牲元件和遮光图案以将透镜的所选部分的中心区域作为透光区域。
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公开(公告)号：US12251081B2
公开(公告)日：2025-03-18
申请号：US17747803
申请日：2022-05-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Wei-Feng Lin , Jau-Jan Deng
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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公开(公告)号：US11943525B2
公开(公告)日：2024-03-26
申请号：US17674675
申请日：2022-02-17
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Wei-Ping Chen , Jau-Jan Deng , Wei-Feng Lin
CPC classification number: H04N23/555 , H04N23/55 , H04N23/56 , H04N23/57
Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
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公开(公告)号：US10734437B2
公开(公告)日：2020-08-04
申请号：US16267370
申请日：2019-02-04
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng Chen , Chia-Yang Chang , Yi Qin
IPC: H01L27/146
Abstract: A chip-scale packaging process for wafer-level camera manufacture includes aligning an optics component wafer with an interposer wafer having a photoresist pattern that forms a plurality of transparent regions, bonding the aligned optics component wafer to the interposer wafer, and dicing the bonded optics component wafer and interposer wafer such that each optics component with interposer has a transparent region. The process further includes dicing an image sensor wafer, aligning the pixel array of each image sensor with the transparent region of a respective optics component with interposer, and bonding each image sensor to its respective optics component with interposer. Each interposer provides alignment between its respective optics component center and its respective pixel array center of the image sensor based on the respective transparent region. The interposer further provides a back focal length for focusing light from the optics component onto a top surface of the pixel array.
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