Invention Grant
- Patent Title: Microelectronic device having an air core inductor
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Application No.: US15376872Application Date: 2016-12-13
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Publication No.: US10085342B2Publication Date: 2018-09-25
- Inventor: Bok Eng Cheah , Jackson Chung Peng Kong , Khang Choong Yong , Min Suet Lim , Chin Lee Kuan , Howe Yin Loo
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/48 ; H05K1/16 ; H01F17/02 ; H01F17/00 ; H01F41/04 ; H01L23/498 ; H01L21/48 ; H01L23/00

Abstract:
A microelectronic device incorporating an air core inductor having one or more inserts to provide efficiency of the inductor are described. One or more inserts having a selected permeability may be placed within regions defined by coils of the air core inductor. The inserts can be formed of a solid material of the selected permeability or such a material can be applied to other structures, such as circuit components. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20180168043A1 MICROELECTRONIC DEVICE HAVING AN AIR CORE INDUCTOR Public/Granted day:2018-06-14
Information query
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