- 专利标题： Apparatus for manufacturing semiconductor wafer
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申请号： US14410190申请日： 2013-06-24
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公开(公告)号： US10090175B2公开(公告)日： 2018-10-02
- 发明人: Jin Woo Lee
- 申请人： SCIENTIFIC VALUE SOLUTIONS CO. LTD
- 申请人地址： KR Anseong-si
- 专利权人： SCIENTIFIC VALUE SOLUTIONS CO. LTD
- 当前专利权人： SCIENTIFIC VALUE SOLUTIONS CO. LTD
- 当前专利权人地址： KR Anseong-si
- 代理机构： Cantor Colburn LLP
- 优先权： KR10-2012-0067613 20120622; KR10-2012-0067634 20120622
- 国际申请： PCT/KR2013/005558 WO 20130624
- 国际公布： WO2013/191520 WO 20131227
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/683 ; H01L21/687 ; C25D17/00 ; H01L21/288 ; H01L21/768
摘要：
An apparatus for manufacturing a semiconductor wafer comprises: a wafer chuck which holds the rear surface of a wafer having a via hole; a cap which is installed in such a way as to move up and down above the wafer chuck and has a sealed lip which forms a liquid reservoir by sealing the outer peripheral portion of the upper surface of the wafer; and a nozzle which injects and recovers processing liquids to and from a reaction chamber.
公开/授权文献
- US20150340249A1 APPARATUS FOR MANUFACTURING SEMICONDUCTOR WAFER 公开/授权日：2015-11-26
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