The present disclosure relates to a method for fabrication of a conductor bar and to a use of a conductor tape with applied putty for the fabrication of a conductor bar. Described is a method for fabrication of a conductor bar including, applying a putty at one side of a conductor tape, applying a release foil at the other side of the putty opposed to the conductor tape, removing the release foil before applying the conductor tape to the narrow side of the conductor bar, providing a pressing mold with rounded edges at the inner side of the pressing mold, surrounding the conductor bar with putty and conductor tape with the pressing mold, and hot pressing the conductor bar with the pressing mold.