Invention Grant
- Patent Title: Adhesive film and sealing product for organic electronic device using same
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Application No.: US14527182Application Date: 2014-10-29
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Publication No.: US10093785B2Publication Date: 2018-10-09
- Inventor: Seung Min Lee , Suk Ky Chang , Hyun Jee Yoo , Jung Sup Shim , Yoon Gyung Cho , Kyung Yul Bae
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0085427 20120803; KR10-2013-0092549 20130805
- Main IPC: H01L21/56
- IPC: H01L21/56 ; C08K3/22 ; C09J163/00 ; C08G59/50 ; C08L63/00 ; H01L51/52 ; C08K3/01
Abstract:
Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.
Public/Granted literature
- US20150048356A1 ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME Public/Granted day:2015-02-19
Information query
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