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    Touch panel
    3.
    发明授权
    Touch panel 有权

    公开(公告)号：US09823763B2

    公开(公告)日：2017-11-21

    申请号：US14158544

    申请日：2014-01-17

    Applicant: LG CHEM, LTD.

    Inventor： Min Soo Park ,  Se Woo Yang ,  Suk Ky Chang ,  Seung Min Lee

    IPC: B32B7/12 ,  G06F3/041 ,  C09J133/08 ,  C09J7/02 ,  C08F220/10 ,  C09J4/00 ,  C09J133/14 ,  C08K5/37

    CPC classification number: G06F3/0412 ,  C08F220/10 ,  C08K5/37 ,  C08L41/00 ,  C09J4/00 ,  C09J7/385 ,  C09J133/08 ,  C09J133/14 ,  G06F3/041 ,  Y10T428/2891

    Abstract: Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and having a peel strength with respect to a polycarbonate sheet of 1,900 g/25 mm or more. The pressure-sensitive adhesive layer includes an acryl polymer compound containing an acryl polymer and a thiol polymer derived by binding a thiol compound into a chain, or a side chain or terminal end of a chain of the acryl polymer. Accordingly, penetration of oxygen, moisture or other impurities at an interface between the base film and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and a pressure-sensitive adhesive layer may be effectively inhibited, and degradation in optical properties such as visibility due to bubbles generated at a pressure-sensitive adhesive interface may be prevented. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, the change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel may be stably driven for a long time.

    Adhesive film and method for encapsulating organic electronic device using same
    7.
    发明授权
    Adhesive film and method for encapsulating organic electronic device using same 有权
    粘合膜和使用其的封装有机电子器件的方法

    公开(公告)号：US09343702B2

    公开(公告)日：2016-05-17

    申请号：US14609172

    申请日：2015-01-29

    Applicant: LG Chem, Ltd.

    Inventor： Kyung Yul Bae ,  Hyun Jee Yoo ,  Seung Min Lee ,  Yoon Gyung Cho ,  Suk Ky Chang ,  Jung Sup Shim

    IPC: H01L51/52 ,  C09J163/00 ,  C09J7/00 ,  B32B37/00 ,  B32B37/12

    CPC classification number: H01L51/5253 ,  B32B37/025 ,  B32B37/12 ,  B32B2310/0806 ,  B32B2457/206 ,  C09J7/00 ,  C09J7/10 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2463/00 ,  Y10T428/1471

    Abstract: The present invention relates to an adhesive film, to an encapsulated product of an organic electronic device using same and to a method for encapsulating an organic electronic device using same. More particularly, an adhesive film for encapsulating an organic electronic device comprises: a protective film layer, a first adhesive layer, a second adhesive layer and a release film layer sequentially arranged. The peel strength (A) between the first adhesive layer and the protective film layer is lower than the peel strength (B) between the second adhesive layer and the release film layer, and the peel strength (B) between the second adhesive layer and the release film layer is lower than the peel strength (C) between the first adhesive layer and an encapsulation substrate, thus improving faults during a peeling process.

    Abstract translation: 本发明涉及一种粘合膜，涉及使用其的有机电子器件的封装产品以及使用该有机电子器件封装的方法。 更具体地，用于封装有机电子器件的粘合膜包括：顺序地布置保护膜层，第一粘合层，第二粘合层和剥离膜层。 第一粘合层和保护膜层之间的剥离强度（A）低于第二粘合层和剥离膜层之间的剥离强度（B），第二粘合层与剥离膜层之间的剥离强度（B） 剥离膜层比第一粘合层和封装基板的剥离强度（C）低，从而改善剥离过程中的缺陷。

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