Invention Grant
- Patent Title: Scattering measurement system and method
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Application No.: US15369190Application Date: 2016-12-05
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Publication No.: US10094774B2Publication Date: 2018-10-09
- Inventor: Chia-Liang Yeh , Yi-Chang Chen , Yi-Sha Ku , Chun-Wei Lo
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu County
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu County
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW104126218A 20150812; TW105125725A 20160812
- Main IPC: G01B11/30
- IPC: G01B11/30 ; G01N21/47 ; G01B11/24 ; H01L21/66

Abstract:
A scattering measurement system is provided, including: a light source generator for generating a detection light beam with discontinuous multi-wavelengths, and generating a multi-order diffraction light beam with three-dimensional feature information when the detection light beam is incident on an object; a detector having a photosensitive array for receiving and converting the multi-order diffraction light beam into multi-order diffraction signals with the three-dimensional feature information; and a processing module for receiving the multi-order diffraction signals and comparing the multi-order diffraction signals with multi-order diffraction feature patterns in a database so as to analyze the three-dimensional feature information of the object.
Public/Granted literature
- US20170082536A1 SCATTERING MEASUREMENT SYSTEM AND METHOD Public/Granted day:2017-03-23
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