Invention Grant
- Patent Title: Cooling of wide bandgap semiconductor devices
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Application No.: US15485676Application Date: 2017-04-12
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Publication No.: US10096538B2Publication Date: 2018-10-09
- Inventor: Bruno Agostini , Daniele Torresin , Francesco Agostini , Mathieu Habert , Munaf Rahimo
- Applicant: ABB Schweiz AG
- Applicant Address: CH Baden
- Assignee: ABB Schweiz AG
- Current Assignee: ABB Schweiz AG
- Current Assignee Address: CH Baden
- Agency: Taft Stettinius & Hollister LLP
- Agent J. Bruce Schelkopf
- Priority: EP16165167 20160413
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L29/16 ; H01L29/739 ; H01L29/78 ; H05K7/20 ; F25B25/00 ; H01L23/473 ; H01L29/20 ; H01L29/32 ; H01L29/22
Abstract:
A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.
Public/Granted literature
- US20170301607A1 COOLING OF WIDE BANDGAP SEMICONDUCTOR DEVICES Public/Granted day:2017-10-19
Information query
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