公开(公告)号：US20220192050A1

公开(公告)日：2022-06-16

申请号：US17551736

申请日：2021-12-15

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

IPC: H05K7/20 ,  F28D15/02

Abstract: The disclosure relates to a vapor chamber for cooling an electronic component. The vapor chamber includes a bottom cover for receiving waste heat from the electronic component, a top cover, wherein the bottom cover and the top cover are formed such that a vapor cavity for accommodating a liquid is formed between the bottom cover and the top cover, a crate element for providing mechanical strength to the vapor chamber, wherein the crate element has at least one compartment, which is formed by at least three side panels being connected to each other and extending from the bottom cover to the top cover, and a top recess facing the top cover and a bottom recess facing the bottom cover, and at least one porous pillar for transferring the liquid from the top cover to the bottom cover.

公开(公告)号：US20210095931A1

公开(公告)日：2021-04-01

申请号：US17032025

申请日：2020-09-25

Applicant: ABB Schweiz AG

Inventor： Matteo Bortolato ,  Bruno Agostini ,  Andrey Petrov ,  Daniele Torresin

IPC: F28F3/12 ,  F28D15/02

Abstract: The invention relates to a vapor chamber (10), comprising a sealed casing (12) which comprises two main walls, wherein a first main wall is an evaporator wall (14) and a second main wall is a condenser wall (16), wherein the two main walls are connected by side connections (18, 20) to form a sealed volume (21) inside the two main walls and the side connections (18, 20), wherein a plurality of pillars (22) is provided in the sealed volume (21) such, that the pillars (22) connect the evaporator wall (14) and the condenser wall (16), wherein the pillars (22) have a first contact area (24) to the evaporator wall (14) and a second contact area (26) to the condenser wall (16), and wherein the pillars (22) further comprise an intermediate cross section area (28) being arranged between the first contact area (24) and the second contact area (26), wherein the extension of the intermediate cross section area (28) is smaller compared to the extension of both of the first contact area (24) and the second contact area (26).

公开(公告)号：US20180368292A1

公开(公告)日：2018-12-20

申请号：US16113341

申请日：2018-08-27

Applicant: ABB Schweiz AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

IPC: H05K7/20 ,  F28F27/02 ,  H01L23/427

CPC classification number: H05K7/20936 ,  F28F27/02 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20354 ,  H05K7/20381

Abstract: A heat exchanger assembly (1) is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit (100), the passive cooling circuit comprising an evaporator (110) connectable to a device (50) to be cooled for conducting heat from the device (50) to be cooled to the cooling fluid within the evaporator (110), thereby evaporating the cooling fluid, and a condenser (120) interconnected with the evaporator (110) for receiving the evaporated cooling fluid from the evaporator (110), releasing heat from the cooling fluid to an environment of the condenser (120), thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit (200) comprising a compressor (250) and an auxiliary condenser (220), the active partial circuit (200) being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit (200), the cooling fluid from the evaporator (110), for compressing the received cooling fluid by the compressor (250), for releasing heat, by the auxiliary condenser (220), from the compressed cooling fluid to an environment of the auxiliary condenser (220), and for returning the condensed cooling fluid to the evaporator (110). Furthermore, the passive cooling circuit (100) is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

公开(公告)号：US10077947B2

公开(公告)日：2018-09-18

申请号：US15272137

申请日：2016-09-21

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Timo Koivuluoma

IPC: F28D15/00 ,  F28D15/04 ,  F28D15/02 ,  F28F3/02 ,  F28F13/10 ,  H01L23/427 ,  H01L23/467 ,  F28D21/00

CPC classification number: F28D15/046 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28D15/0283 ,  F28D15/04 ,  F28D2021/0029 ,  F28F3/02 ,  F28F3/025 ,  F28F13/10 ,  F28F2215/06 ,  H01L23/427 ,  H01L23/467

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

公开(公告)号：US12196497B2

公开(公告)日：2025-01-14

申请号：US17557485

申请日：2021-12-21

Applicant: ABB Schweiz AG

Inventor： Daniele Torresin ,  Bruno Agostini ,  Andrey Petrov

IPC: F28D15/04

Abstract: A heat dissipation device is provided herein. The heat dissipation device includes an evaporator chamber at least partially filled with a working fluid to be evaporated when being heated by a heat source; at least one condenser chamber for receiving evaporated working fluid and for condensing the evaporated working fluid, wherein the condenser chamber is interconnected with the evaporator chamber in a fluid conductive manner; and at least one air fin element interconnected between the condenser chamber and one of a further condenser chamber and a side wall of the heat dissipation device; wherein the air fin element has a triply periodic surface providing air fins.

公开(公告)号：US12066255B2

公开(公告)日：2024-08-20

申请号：US17665798

申请日：2022-02-07

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

IPC: F28D15/02 ,  B22F5/10 ,  B23P15/26 ,  F28D15/04 ,  B33Y80/00

CPC classification number: F28D15/0283 ,  B22F5/10 ,  B23P15/26 ,  F28D15/046 ,  B22F2998/10 ,  B23P2700/09 ,  B33Y80/00

Abstract: Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

公开(公告)号：US20220260322A1

公开(公告)日：2022-08-18

申请号：US17665798

申请日：2022-02-07

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Andrey Petrov

IPC: F28D15/02 ,  F28D15/04 ,  B23P15/26 ,  B22F5/10

Abstract: Disclosed herein is a blank for a heat-transfer device that includes a vapor chamber enclosed by a body of the heat-transfer device, and a charging tube connected to the vapor chamber, wherein a part of the charging tube protruding from the body has at least one unsealed sealing zone with an oblong flow area, where a width of the charging tube exceeds a height of the charging tube.

公开(公告)号：US20210125894A1

公开(公告)日：2021-04-29

申请号：US17084009

申请日：2020-10-29

Applicant: ABB Schweiz AG

Inventor： Andrey Petrov ,  Jacim Jacimovic ,  Moritz Boehm ,  Bruno Agostini ,  Daniele Torresin

IPC: H01L23/373 ,  H01L23/473 ,  H01L21/48

Abstract: The invention relates to a two-phase heat transfer device for dissipating heat from a heat source, for instance a power semiconductor module, by a heat transfer medium, wherein the two-phase heat transfer device includes a main body, wherein the main body is formed by a body material and includes a multi-dimensional void network, wherein the multi-dimensional void network includes voids and is adapted for containing the heat transfer medium, wherein the multi-dimensional void network is adapted such that a flow of the heat transfer medium along a path through the main body is based on a variation in capillary action exerted by the multi-dimensional void network on the heat transfer medium along the path. Further the invention relates to a power semiconductor module comprising the above two-phase heat transfer device for heat dissipation and to a method for producing the above two-phase heat transfer device.

公开(公告)号：US10517195B2

公开(公告)日：2019-12-24

申请号：US16113341

申请日：2018-08-27

Applicant: ABB Schweiz AG

Inventor： Francesco Agostini ,  Daniele Torresin ,  Mathieu Habert ,  Bruno Agostini

IPC: H05K7/20 ,  H01L23/427 ,  F28F27/02

Abstract: A heat exchanger assembly is disclosed. The heat exchanger assembly comprises at least one passive cooling circuit, the passive cooling circuit including an evaporator connectable to a device to be cooled for conducting heat from the device to be cooled to the cooling fluid within the evaporator, thereby evaporating the cooling fluid, and a condenser interconnected with the evaporator for receiving the evaporated cooling fluid from the evaporator, releasing heat from the cooling fluid to an environment of the condenser, thereby condensing the cooling fluid, and for returning the condensed cooling fluid to the evaporator; and an active partial circuit comprising a compressor and an auxiliary condenser, the active partial circuit being activatable and deactivatable and being connected to the passive cooling circuit for receiving, in an activated state of the active partial circuit, the cooling fluid from the evaporator, for compressing the received cooling fluid by the compressor, for releasing heat, by the auxiliary condenser, from the compressed cooling fluid to an environment of the auxiliary condenser, and for returning the condensed cooling fluid to the evaporator. Furthermore, the passive cooling circuit is a base-to-air type thermosiphon or an air-to-air type thermosiphon.

公开(公告)号：US10096538B2

公开(公告)日：2018-10-09

申请号：US15485676

申请日：2017-04-12

Applicant: ABB Schweiz AG

Inventor： Bruno Agostini ,  Daniele Torresin ,  Francesco Agostini ,  Mathieu Habert ,  Munaf Rahimo

IPC: H01L23/427 ,  H01L29/16 ,  H01L29/739 ,  H01L29/78 ,  H05K7/20 ,  F25B25/00 ,  H01L23/473 ,  H01L29/20 ,  H01L29/32 ,  H01L29/22

Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.