- 专利标题: Adhesive having structural integrity and insulative properties
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申请号: US15475685申请日: 2017-03-31
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公开(公告)号: US10100231B2公开(公告)日: 2018-10-16
- 发明人: Tianjian Huang , Robert Sandilla , Daniel Waski , Kristina Thompson , John Meccia
- 申请人: HENKEL IP & HOLDING GMBH
- 申请人地址: DE Duesseldorf
- 专利权人: HENKEL IP & HOLDING GMBH
- 当前专利权人: HENKEL IP & HOLDING GMBH
- 当前专利权人地址: DE Duesseldorf
- 代理商 Sun Hee Lehmann
- 主分类号: C09J11/08
- IPC分类号: C09J11/08 ; C09J131/04 ; D21H19/10 ; D21H27/36 ; D21H11/14 ; D21H21/52 ; B32B7/12 ; B32B3/28 ; B32B1/02 ; D21H19/54 ; D21H21/54 ; D21H27/10 ; D21H19/24 ; B65D81/38 ; C08K9/10 ; C08L3/02
摘要:
An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.