Invention Grant
- Patent Title: Resistance variable memory structure
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Application No.: US15811249Application Date: 2017-11-13
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Publication No.: US10103330B2Publication Date: 2018-10-16
- Inventor: Kuo-Chi Tu , Chih-Yang Chang , Hsia-Wei Chen , Yu-Wen Liao , Chin-Chieh Yang , Wen-Ting Chu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L45/00
- IPC: H01L45/00 ; H01L27/24

Abstract:
A semiconductor structure includes a resistance variable memory structure. The semiconductor structure also includes a dielectric layer. The resistance variable memory structure is over the dielectric layer. The resistance variable memory structure includes a first electrode disposed over the dielectric layer. The first electrode has a sidewall surface. A resistance variable layer has a first portion which is disposed over the sidewall surface of the first electrode and a second portion which extends from the first portion away from the first electrode. A second electrode is over the resistance variable layer.
Public/Granted literature
- US20180083188A1 Resistance Variable Memory Structure Public/Granted day:2018-03-22
Information query
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