Invention Grant
- Patent Title: Photosensitive resin composition and method for forming quantum dot pattern using the same
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Application No.: US14437047Application Date: 2014-06-23
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Publication No.: US10108089B2Publication Date: 2018-10-23
- Inventor: Jingxia Gu , Shi Shu , Feng Zhang , Guanbao Hui
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Brooks Kushman P.C.
- Priority: CN201310744287 20131230
- International Application: PCT/CN2014/080493 WO 20140623
- International Announcement: WO2015/100968 WO 20150709
- Main IPC: G03F7/031
- IPC: G03F7/031 ; G03F7/029 ; G03F7/028 ; G03F7/027 ; G03F7/032 ; G03F7/004 ; G03F7/30 ; G03F7/20
Abstract:
The present disclosure provides a photosensitive resin composition and a method for forming a quantum dot pattern using the same. The photosensitive resin composition includes quantum dots which are dispersed in the photosensitive resin composition and each has a modification layer. The method for forming a quantum dot pattern includes coating, exposing and developing a photoresist to obtain the quantum dot pattern, wherein the photoresist is the above-mentioned photosensitive resin composition.
Public/Granted literature
- US20160011506A1 PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR FORMING QUANTUM DOT PATTERN USING THE SAME Public/Granted day:2016-01-14
Information query
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