Invention Grant
- Patent Title: Planar heat pipe
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Application No.: US15507027Application Date: 2015-08-17
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Publication No.: US10119770B2Publication Date: 2018-11-06
- Inventor: Hirofumi Aoki , Hiroshi Sakai , Tatsuro Miura , Yoshikatsu Inagaki
- Applicant: Furukawa Electric Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2014-176173 20140829
- International Application: PCT/JP2015/073018 WO 20150817
- International Announcement: WO2016/031604 WO 20160303
- Main IPC: F28D15/00
- IPC: F28D15/00 ; F28F1/04 ; B23K26/21 ; B23K11/02 ; B23K11/11 ; F28D15/04 ; H01L23/427

Abstract:
A planar heat pipe includes a container having a hollow portion provided at a central portion thereof with two opposing plate-shaped bodies, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. At least one of the plate-shaped bodies is a composite member of two or more types of metal members that are laminated and integrated. A metal member of the composite member forming a layer that contacts the hollow portion has a thermal conductivity of greater than or equal to 200 W/m·K and a metal member of the composite member forming a layer that contacts an exterior has a thermal conductivity of less than or equal to 100 W/m·K, a peripheral portion of the hollow portion being sealed.
Public/Granted literature
- US20170248378A1 Planar Heat Pipe Public/Granted day:2017-08-31
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