Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15646540Application Date: 2017-07-11
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Publication No.: US10128252B2Publication Date: 2018-11-13
- Inventor: Ki-seok Lee , Dae-ik Kim , Yoo-sang Hwang , Bong-soo Kim , Je-min Park
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2016-0174770 20161220
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L23/528 ; H01L29/167 ; H01L29/36 ; G11C11/4091 ; G11C11/408 ; H01L29/423

Abstract:
A semiconductor device includes a substrate including a cell active region and a peripheral active region, a direct contact arranged on a cell insulating pattern formed on the substrate and connected to the cell active region, a bit line structure including a thin conductive pattern, contacting a top surface of the direct contact and extending in one direction, and a peripheral gate structure in the peripheral active region. The peripheral gate structure include a stacked structure of a peripheral gate insulating pattern and a peripheral gate conductive pattern, the thin conductive pattern includes a first material and the peripheral gate conductive pattern include the first material, and a level of an upper surface of the thin conductive pattern is lower than a level of an upper surface of the peripheral gate conductive pattern.
Public/Granted literature
- US20180175045A1 SEMICONDUCTOR DEVICE Public/Granted day:2018-06-21
Information query
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