- 专利标题: Silicon carbide semiconductor device
-
申请号: US15759589申请日: 2016-10-04
-
公开(公告)号: US10134920B2公开(公告)日: 2018-11-20
- 发明人: Kotaro Kawahara , Kohei Ebihara
- 申请人: Mitsubishi Electric Corporation
- 申请人地址: JP Chiyoda-ku
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Chiyoda-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2015-213707 20151030
- 国际申请: PCT/JP2016/079470 WO 20161004
- 国际公布: WO2017/073264 WO 20170504
- 主分类号: H01L29/861
- IPC分类号: H01L29/861 ; H01L29/868 ; H01L29/06 ; H01L21/04 ; H01L29/16 ; H01L29/167 ; H01L29/36 ; H01L29/66
摘要:
A mesa type p-n junction diode silicon carbide semiconductor device that includes a first silicon carbide semiconductor substrate, a first drift layer formed on the silicon carbide semiconductor substrate, a second anode layer formed on the drift layer, a mesa structure having a flat mesa bottom portion formed in an outer periphery thereof and having a mesa side wall obliquely formed with respect to a top face of the anode layer in a cross-section ranging from the anode layer to the drift layer, a second lightly doped region formed from an edge of the anode layer to the mesa bottom portion, and a second highly doped region formed on the side of the mesa side wall in the lightly doped region in contact with the edge of the anode layer and in a portion connected to the mesa bottom portion at a lower part of the mesa side wall.
公开/授权文献
- US20180254354A1 SILICON CARBIDE SEMICONDUCTOR DEVICE 公开/授权日:2018-09-06
信息查询
IPC分类: