Invention Grant
- Patent Title: Plated opening with vent path
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Application No.: US15380054Application Date: 2016-12-15
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Publication No.: US10143084B2Publication Date: 2018-11-27
- Inventor: Michael B. Vincent , Zhiwei Gong , Scott M. Hayes
- Applicant: NXP USA, INC.
- Applicant Address: US TX Austin
- Assignee: NXP USA, INC.
- Current Assignee: NXP USA, INC.
- Current Assignee Address: US TX Austin
- Agent David G. Dolezal
- Main IPC: H01K3/10
- IPC: H01K3/10 ; H05K1/11 ; H05K3/42 ; H05K3/00 ; H05K3/28 ; H05K3/34 ; H05K1/18 ; H01L21/48 ; H01L23/498 ; H01L21/56 ; H01L23/31
Abstract:
A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.
Public/Granted literature
- US20180177049A1 PLATED OPENING WITH VENT PATH Public/Granted day:2018-06-21
Information query
