Invention Grant
- Patent Title: Hot melt adhesive composition including a block composite compatibilizer
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Application No.: US15505493Application Date: 2015-08-20
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Publication No.: US10155889B2Publication Date: 2018-12-18
- Inventor: Yi Jin , Kim L. Walton , Gary R. Marchand , Selim Yalvac , Allan Walter Mclennaghan , Burcak Conley , Dean Lee , Rongjuan Cong , Colin Li Pi Shan
- Applicant: Dow Global Technologies LLC
- Applicant Address: US MI Midland
- Assignee: Dow Global Technologies LLC
- Current Assignee: Dow Global Technologies LLC
- Current Assignee Address: US MI Midland
- International Application: PCT/US2015/046031 WO 20150820
- International Announcement: WO2016/028970 WO 20160225
- Main IPC: C09J153/00
- IPC: C09J153/00 ; C08L23/14 ; C08L23/06 ; C08L91/06 ; C09J7/35 ; C08L53/00 ; C09J123/20 ; C09J123/14

Abstract:
A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.
Public/Granted literature
- US20170240784A1 HOT MELT ADHESIVE COMPOSITION INCLUDING A BLOCK COMPOSITE COMPATIBILIZER Public/Granted day:2017-08-24
Information query
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