Invention Grant
- Patent Title: High electron mobility transistor structure
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Application No.: US15443861Application Date: 2017-02-27
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Publication No.: US10164047B2Publication Date: 2018-12-25
- Inventor: Chen-Ju Yu , Chih-Wen Hsiung , Fu-Wei Yao , Chun-Wei Hsu , King-Yuen Wong , Jiun-Lei Jerry Yu , Fu-Chih Yang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/20
- IPC: H01L29/20 ; H01L29/778 ; H01L29/66 ; H01L21/02 ; H01L29/423 ; H01L29/10 ; H01L21/225 ; H01L21/3065 ; H01L21/3205 ; H01L21/321 ; H01L21/3213 ; H01L21/324 ; H01L29/201 ; H01L29/205 ; H01L29/06 ; H01L29/08

Abstract:
A high electron mobility transistor (HEMT) includes a silicon substrate, an unintentionally doped gallium nitride (UID GaN) layer over the silicon substrate. The HEMT further includes a donor-supply layer over the UID GaN layer, a gate structure, a drain, and a source over the donor-supply layer. The HEMT further includes a dielectric layer having one or more dielectric plug portions in the donor-supply layer and top portions between the gate structure and the drain over the donor-supply layer. A method for making the HEMT is also provided.
Public/Granted literature
- US20170170295A1 HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE Public/Granted day:2017-06-15
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