- 专利标题: High electron mobility transistor structure
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申请号: US15443861申请日: 2017-02-27
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公开(公告)号: US10164047B2公开(公告)日: 2018-12-25
- 发明人: Chen-Ju Yu , Chih-Wen Hsiung , Fu-Wei Yao , Chun-Wei Hsu , King-Yuen Wong , Jiun-Lei Jerry Yu , Fu-Chih Yang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Haynes and Boone, LLP
- 主分类号: H01L29/20
- IPC分类号: H01L29/20 ; H01L29/778 ; H01L29/66 ; H01L21/02 ; H01L29/423 ; H01L29/10 ; H01L21/225 ; H01L21/3065 ; H01L21/3205 ; H01L21/321 ; H01L21/3213 ; H01L21/324 ; H01L29/201 ; H01L29/205 ; H01L29/06 ; H01L29/08
摘要:
A high electron mobility transistor (HEMT) includes a silicon substrate, an unintentionally doped gallium nitride (UID GaN) layer over the silicon substrate. The HEMT further includes a donor-supply layer over the UID GaN layer, a gate structure, a drain, and a source over the donor-supply layer. The HEMT further includes a dielectric layer having one or more dielectric plug portions in the donor-supply layer and top portions between the gate structure and the drain over the donor-supply layer. A method for making the HEMT is also provided.
公开/授权文献
- US20170170295A1 HIGH ELECTRON MOBILITY TRANSISTOR STRUCTURE 公开/授权日:2017-06-15
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