Invention Grant
- Patent Title: Fluid control apparatus
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Application No.: US15462417Application Date: 2017-03-17
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Publication No.: US10165684B2Publication Date: 2018-12-25
- Inventor: Katsuya Ohtani
- Applicant: HORIBA STEC, Co., Ltd.
- Applicant Address: JP Kyoto-shi, Kyoto
- Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee: HORIBA STEC, Co., Ltd.
- Current Assignee Address: JP Kyoto-shi, Kyoto
- Agency: Alleman Hall Creasman & Tuttle LLP
- Priority: JP2016-066609 20160329
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/18 ; H05K3/36 ; H01R12/71 ; H01R12/50 ; H01R12/73 ; H05K1/11

Abstract:
A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.
Public/Granted literature
- US20170285666A1 FLUID CONTROL APPARATUS Public/Granted day:2017-10-05
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