- 专利标题: Semiconductor device
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申请号: US15436179申请日: 2017-02-17
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公开(公告)号: US10181515B2公开(公告)日: 2019-01-15
- 发明人: Mariko Suzuki , Tadashi Sakai
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2016-107939 20160530
- 主分类号: H01L29/16
- IPC分类号: H01L29/16 ; H01L29/47 ; H01L29/40 ; H01L29/872 ; H01L29/36 ; H01L23/29 ; H01L23/31 ; H01L29/66 ; H01L29/732 ; H01L29/861 ; H01L29/868 ; H01L29/06
摘要:
Provided is a semiconductor device according to an embodiment including an i-type or first-conductivity-type first diamond semiconductor layer having a first side surface, a second-conductivity-type second diamond semiconductor layer provided on the first diamond semiconductor layer and having a second side surface, a third diamond semiconductor layer being in contact with the first side surface and the second side surface, the third diamond semiconductor containing nitrogen, a first electrode electrically connected to the first diamond semiconductor layer, and a second electrode electrically connected to the second diamond semiconductor layer.
公开/授权文献
- US20170345899A1 SEMICONDUCTOR DEVICE 公开/授权日:2017-11-30
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