Invention Grant
- Patent Title: Backside sensing BioFET with enhanced performance
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Application No.: US15958053Application Date: 2018-04-20
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Publication No.: US10184912B2Publication Date: 2019-01-22
- Inventor: Chun-Wen Cheng , Yi-Shao Liu , Fei-Lung Lai , Wei-Cheng Lin , Ta-Chuan Liao , Chien-Kuo Yang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: G01N27/414
- IPC: G01N27/414

Abstract:
The present disclosure provides a bio-field effect transistor (BioFET) and a method of fabricating a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a substrate, a transistor structure having a treated layer adjacent to the channel region, an isolation layer, and a dielectric layer in an opening of the isolation layer on the treated layer. The dielectric layer and the treated layer are disposed on opposite side of the transistor from a gate structure. The treated layer may be a lightly doped channel layer or a depleted layer.
Public/Granted literature
- US20180238827A1 Backside Sensing BioFET with Enhanced Performance Public/Granted day:2018-08-23
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