- 专利标题: Multilayer capacitor and board having the same mounted thereon
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申请号: US15645601申请日: 2017-07-10
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公开(公告)号: US10192685B2公开(公告)日: 2019-01-29
- 发明人: Heung Kil Park , Jong Hwan Park , Se Hun Park , Young Ghyu Ahn
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si, Gyeonggi-do
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2016-0156573 20161123
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G4/228 ; H01G4/005 ; H05K1/18 ; H05K3/34
摘要:
A multilayer capacitor includes a capacitor body including a plurality of first and second internal electrodes alternately disposed therein and a dielectric layer interposed therebetween, and having first to sixth surfaces, opposing each other, respectively; a plurality of external electrodes connected to the first and second internal electrodes; an insulating layer disposed on the first surface; first and second terminal electrodes spaced apart from each other in a direction in which the third and fourth surfaces are connected, on the insulating layer; and a connecting member electrically connecting the first and second terminal electrodes and the external electrodes.
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