- 专利标题： Suspension board assembly sheet having circuits, method of manufacturing the same and method of inspecting the same
-
申请号： US15208655申请日： 2016-07-13
-
公开(公告)号： US10201077B2公开(公告)日： 2019-02-05
- 发明人: Yuu Sugimoto , Hiroyuki Tanabe , Naohiro Terada
- 申请人： Nitto Denko Corporation
- 申请人地址： JP Ibaraki-shi, Osaka
- 专利权人： NITTO DENKO CORPORATION
- 当前专利权人： NITTO DENKO CORPORATION
- 当前专利权人地址： JP Ibaraki-shi, Osaka
- 代理机构： Panitch Schwarze Belisario & Nadel LLP
- 优先权： JP2015-139801 20150713
- 主分类号： H05K1/14
- IPC分类号： H05K1/14 ; H01L23/522 ; H05K1/02 ; H05K1/11 ; H05K3/42 ; H05K3/00 ; G01R1/04 ; G11B5/48
摘要：
A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
公开/授权文献
信息查询
