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公开(公告)号：US10201077B2
公开(公告)日：2019-02-05
申请号：US15208655
申请日：2016-07-13
发明人： Yuu Sugimoto , Hiroyuki Tanabe , Naohiro Terada
摘要： A suspension board and an inspection substrate are integrally supported by a support frame. In the suspension board, first and second insulating layers are laminated on a support substrate in this order. Part of a line is formed on the first insulating layer, and the remaining line is formed on the second insulating layer. A via connecting the part of the line to the remaining line is formed in the second insulating layer. In the inspection substrate, the first and second insulating layers are laminated on the support substrate in this order. A first inspection conductor layer is formed on the first insulating layer, and a second inspection conductor layer is formed on the second insulating layer. A via connecting the first inspection conductor layer to the second inspection conductor layer is formed in the second insulating layer.
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公开(公告)号：US09949370B2
公开(公告)日：2018-04-17
申请号：US15373583
申请日：2016-12-09
CPC分类号： H05K1/05 , G11B5/483 , G11B5/4853 , H05K1/117 , H05K3/22 , H05K3/3442 , H05K3/4608 , H05K3/4644 , H05K2201/10151 , H05K2201/10227 , Y02P70/613
摘要： A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, a conductor layer disposed at the one side of the base insulating layer and including a connecting terminal electrically connected to a slider, a cover insulating layer covering the conductor layer to expose the connecting terminal and disposed at the one side of the base insulating layer, and a plating layer covering the connecting terminal. The cover insulating layer includes a first cover insulating layer disposed at the one side of the base insulating layer and a second cover insulating layer disposed at the one side of the first cover insulating layer, and the thickness of the plating layer is not more than the total sum of the thickness of the first cover insulating layer and that of the second cover insulating layer.
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公开(公告)号：US09502058B2
公开(公告)日：2016-11-22
申请号：US14878319
申请日：2015-10-08
IPC分类号： G11B5/48
CPC分类号： G11B5/4853 , G11B5/4826 , G11B5/484
摘要： A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion.
摘要翻译： 具有电路的悬挂板包括金属支撑层，在其一个厚度方向上的绝缘基底层，设置在绝缘基底层上的导电图案，设置在绝缘基底层上以覆盖导电性的绝缘覆盖层 图案，以及用于支撑包括薄基座部分的滑块的基座。 薄基座部分包括基底绝缘层中包括的基座基层，包括在基座基层上的导电图案中的基座导电层，以及包括在绝缘覆盖层中并设置在基座导电 层。 导电图案包括放置成在具有较窄部分的绝缘基底层上延伸的第一线，并且基座导电层的尺寸为较窄部分的尺寸的0.5至3倍。
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4.发明授权Suspension board assembly sheet with circuits and method for manufacturing the same 有权具有电路的悬挂板组装片及其制造方法公开(公告)号：US09451704B2
公开(公告)日：2016-09-20
申请号：US14062264
申请日：2013-10-24
发明人： Terukazu Ihara , Jun Ishii , Naohiro Terada
CPC分类号： H05K3/10 , G11B5/486 , H05K1/0228 , H05K1/0245 , H05K1/025 , H05K1/0265 , H05K1/056 , H05K3/0097 , H05K3/06 , H05K3/4685 , H05K2201/09236 , H05K2201/09254 , H05K2201/09509 , H05K2201/09554 , H05K2201/09627 , H05K2201/0979 , H05K2203/0323 , Y10T29/49155
摘要： A plurality of suspension boards and an inspection substrate are integrally supported by a support frame. In each suspension board, a line is formed on a conductive first support substrate via a first insulating layer. The first support substrate and the line are electrically connected by a first via in the first insulating layer. In the inspection substrate, a conductor layer is formed on a conductive second support substrate with a second insulating layer sandwiched therebetween. The second support substrate and the conductor layer are electrically connected by a second via in the second insulating layer. The first via and the second via have the same configuration.
摘要翻译： 多个悬挂板和检查基板由支撑框架一体地支撑。 在每个悬挂板中，经由第一绝缘层在导电的第一支撑基板上形成线。 第一支撑基板和线通过第一绝缘层中的第一通孔电连接。 在检查基板中，导电层形成在导电性的第二支撑基板上，其间夹着第二绝缘层。 第二支撑基板和导体层通过第二绝缘层中的第二通孔电连接。 第一通孔和第二通孔具有相同的配置。
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公开(公告)号：US10420224B2
公开(公告)日：2019-09-17
申请号：US15467085
申请日：2017-03-23
发明人： Jun Ishii , Terukazu Ihara , Naohiro Terada
摘要： A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
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公开(公告)号：US09763334B2
公开(公告)日：2017-09-12
申请号：US14273657
申请日：2014-05-09
发明人： Terukazu Ihara , Naohiro Terada
CPC分类号： H05K3/3405 , G11B5/4853 , H05K2201/09427 , H05K2201/09727 , H05K2203/046 , Y10T29/49147
摘要： Heat-assisted wiring traces and a conductive support substrate are respectively formed on first and second surfaces of an insulating layer. Further, connection terminals electrically insulated from the support substrate and electrically respectively connected to the heat-assisted wiring traces are formed on the second surface of the insulating layer. Each connection terminal has an element connection portion, a pattern connection portion and a spread blocking portion. When a circuit element is connected to the element connection portion of the connection terminal by solder, spreading of a molten solder applied to the element connection portion to the pattern connection portion is blocked by the spread blocking portion.
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公开(公告)号：US09572259B2
公开(公告)日：2017-02-14
申请号：US14755173
申请日：2015-06-30
发明人： Naohiro Terada , Yoshito Fujimura
CPC分类号： H05K1/181 , H05K1/0281 , H05K1/189 , H05K2201/0394 , H05K2201/2009 , Y02P70/611
摘要： A suspension board with circuit includes a metal supporting board having a support opening portion passing through a thickness direction; a base insulating layer disposed on an upper surface of the metal supporting board and having an insulating opening portion passing through the thickness direction, when projected in the thickness direction, to be included in the support opening portion; and a conductive layer having a wire portion disposed on an upper surface of the base insulating layer and a terminal portion disposed in the insulating opening portion to be connected to an electronic element and connected to the wire portion. The base insulating layer has a cutout portion obtained by cutting out the base insulating layer in a direction orthogonal to the thickness direction and continuous to the insulating opening portion and the terminal portion includes a terminal free end portion opened by the cutout portion.
摘要翻译： 具有电路的悬挂板包括具有穿过厚度方向的支撑开口部分的金属支撑板; 基底绝缘层，其设置在所述金属支撑基板的上表面上，具有贯穿所述厚度方向的绝缘开口部，当在厚度方向上突出时，所述绝缘开口部包含在所述支撑开口部中; 以及导电层，其具有布置在所述基底绝缘层的上表面上的导线部分和设置在所述绝缘开口部分中以连接到电子元件并连接到所述导线部分的端子部分。 所述基底绝缘层具有通过在与所述厚度方向正交的方向上切割所述基底绝缘层而与所述绝缘开口部连续的端部而形成的切口部，并且所述端子部包括由所述切口部开口的端子自由端部。
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公开(公告)号：US09865288B2
公开(公告)日：2018-01-09
申请号：US15040199
申请日：2016-02-10
CPC分类号： G11B5/4853 , G06F1/184 , G11B5/4826 , G11B5/4873 , H05K1/056 , H05K3/305 , Y02P70/613
摘要： A suspension board with circuit includes one pair of pedestals. A pedestal conductive layer of one pedestal has a fan portion and a continuous portion. The pedestal conductive layer of the other pedestal has at least the fan portion. When the pedestal conductive layer of the other pedestal has only the fan portion, the pedestal supporting layer is disposed so as to be overlapped with the fan portion in the thickness direction in each of the pedestals and so as not to be overlapped with the continuous portion in the one pedestal and when the pedestal conductive layer of the other pedestal has the continuous portion, the pedestal supporting layer is disposed so as to be overlapped with the continuous portion or is disposed so as to be overlapped with the fan portion and so as not to be overlapped with the continuous portion in each of the pedestals.
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公开(公告)号：US09642262B2
公开(公告)日：2017-05-02
申请号：US14141705
申请日：2013-12-27
发明人： Jun Ishii , Terukazu Ihara , Naohiro Terada
CPC分类号： H05K3/4644 , G11B5/486 , H05K1/0271 , H05K3/0052 , H05K3/0097 , H05K2201/09781 , Y10T29/49124
摘要： A dummy trace portion is provided in a region between at least a suspension board with circuit on one end side and a support frame of a suspension board assembly sheet with circuits. A base insulating layer is formed on a support substrate in the dummy trace portion. A plurality of conductor traces are formed on the base insulating layer, and a cover insulating layer is formed on the base insulating layer to cover each conductor trace. At least one of the base insulating layer and the cover insulating layer in the dummy trace portion has a groove.
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公开(公告)号：US10028378B2
公开(公告)日：2018-07-17
申请号：US15373573
申请日：2016-12-09
摘要： A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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