Invention Grant
- Patent Title: Edge reflection reduction
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Application No.: US15945541Application Date: 2018-04-04
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Publication No.: US10211243B2Publication Date: 2019-02-19
- Inventor: Chia-Chun Miao , Yin Qian , Chao-Hung Lin , Chen-Wei Lu , Dyson H. Tai , Ming Zhang , Jin Li
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Christensen O'Connor Johnson Kindness PLLC
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L27/146

Abstract:
A method of image sensor package fabrication includes providing an image sensor, including a pixel array disposed in a semiconductor material, and a first transparent shield adhered to the semiconductor material. The pixel array is disposed between the semiconductor material and the first transparent shield. A light blocking layer is deposited and disposed between lateral edges of the pixel array and lateral edges of the first transparent shield, and a second transparent shield is placed on the image sensor package, where the light blocking layer is disposed between the first transparent shield and the second transparent shield.
Public/Granted literature
- US20180226448A1 EDGE REFLECTION REDUCTION Public/Granted day:2018-08-09
Information query
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