Invention Grant
- Patent Title: Inorganic filler and epoxy resin composition including the same
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Application No.: US14827423Application Date: 2015-08-17
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Publication No.: US10231332B2Publication Date: 2019-03-12
- Inventor: Sanga Ju , Jina Gu , Se Woong Na , Sung Jin Yun
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: LRK Patent Law Firm
- Priority: KR10-2014-0121060 20140912
- Main IPC: C09D1/00
- IPC: C09D1/00 ; C08K9/08 ; H05K1/03 ; C08K9/04 ; H05K1/05 ; C07F5/05 ; C09C1/00 ; C09C3/08 ; C08K3/38 ; H05K3/46
Abstract:
An inorganic filler includes surface-modified boron nitride having a surface on which a polycyclic aromatic hydrocarbon having a functional group is provided.
Public/Granted literature
- US20160081188A1 INORGANIC FILLER AND EPOXY RESIN COMPOSITION INCLUDING THE SAME Public/Granted day:2016-03-17
Information query
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