Invention Grant
- Patent Title: Method, apparatus and system for automatically deriving parameters for an interconnect
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Application No.: US15279725Application Date: 2016-09-29
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Publication No.: US10235486B2Publication Date: 2019-03-19
- Inventor: Krishnan Srinivasan , Robert P. Adler , Robert De Gruijl , Jay Tomlinson , Eric A. Geisler
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In one embodiment, a design tool for designing a system on chip (SoC) includes hardware logic to generate one or more configuration files for a fabric of a SoC to be designed by the design tool. This logic is configured, based at least in part on user input, to generate the one or more configuration files, according to at least one of: automatic derivation of all parameters of the fabric, according to a first user selection; manual input by a user of at least some parameters of the fabric and automatic derivation of at least other parameters of the fabric, according to a second user selection; and manual input by the user of the all parameters of the fabric, according to a third user selection. Other embodiments are described and claimed.
Public/Granted literature
- US20180089342A1 METHOD, APPARATUS AND SYSTEM FOR AUTOMATICALLY DERIVING PARAMETERS FOR AN INTERCONNECT Public/Granted day:2018-03-29
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