Invention Grant
- Patent Title: Semiconductor package and method for fabricating base for semiconductor package
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Application No.: US15893527Application Date: 2018-02-09
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Publication No.: US10236187B2Publication Date: 2019-03-19
- Inventor: Wen-Sung Hsu , Ta-Jen Yu
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/48 ; H01L23/64 ; H01L23/538 ; H01L23/66 ; H01L25/00 ; H01L23/00 ; H05K1/18 ; H05K3/00 ; H05K3/10 ; H05K3/18 ; H05K3/30 ; H01F17/00 ; H01L21/683 ; H01L21/70 ; H01L21/56 ; H01L23/498 ; H05K1/16
Abstract:
The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
Public/Granted literature
- US20180166297A1 SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE Public/Granted day:2018-06-14
Information query
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