Invention Grant
- Patent Title: Methods of forming an interconnection line and methods of fabricating a magnetic memory device using the same
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Application No.: US15227334Application Date: 2016-08-03
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Publication No.: US10236442B2Publication Date: 2019-03-19
- Inventor: Jaehun Seo , Jong-Kyu Kim , Jung-Ik Oh , Inho Kim , Jongchul Park , Gwang-Hyun Baek , Hyun-woo Yang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Ward and Smith, P.A.
- Priority: KR10-2015-0144126 20151015; KR10-2015-0177265 20151211
- Main IPC: H01L43/12
- IPC: H01L43/12 ; H01L21/3213 ; H01L21/02 ; H01L27/22

Abstract:
Provided herein are methods of fabricating a magnetic memory device including forming magnetic tunnel junction patterns on a substrate, forming an interlayered insulating layer on the substrate to cover the magnetic tunnel junction patterns, forming a conductive layer on the interlayered insulating layer, patterning the conductive layer to form interconnection patterns electrically connected to the magnetic tunnel junction patterns, and performing a cleaning process on the interconnection patterns. The cleaning process is performed using a gas mixture of a first gas and a second gas. The first gas contains a hydrogen element (H), and the second gas contains a source gas different from that of the first gas.
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