Invention Grant
- Patent Title: Substrate liquid processing method and substrate liquid processing apparatus
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Application No.: US14828579Application Date: 2015-08-18
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Publication No.: US10242889B2Publication Date: 2019-03-26
- Inventor: Jun Nonaka , Itaru Kanno
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2014-171733 20140826; JP2015-138964 20150710
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02
Abstract:
Disclosed is a substrate liquid processing method. The method includes producing a processing liquid including deionized water, carbon dioxide, and ammonia, which has a PH of a predetermined value in a range of pH 5 to 9; and processing a substrate having a metal exposed, using the processing liquid.
Public/Granted literature
- US20160064257A1 SUBSTRATE LIQUID PROCESSING METHOD AND SUBSTRATE LIQUID PROCESSING APPARATUS Public/Granted day:2016-03-03
Information query
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