Invention Grant
- Patent Title: Fan-out ball grid array package structure and process for manufacturing the same
-
Application No.: US15655724Application Date: 2017-07-20
-
Publication No.: US10242940B2Publication Date: 2019-03-26
- Inventor: Jung-Liang Yeh , Meng-Jen Wang , Tsung-Yueh Tsai , Chih-Ming Hung
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/18 ; G06K9/00 ; H01L21/56
Abstract:
A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.
Public/Granted literature
- US20180108602A1 FAN-OUT BALL GRID ARRAY PACKAGE STRUCTURE AND PROCESS FOR MANUFACTURING THE SAME Public/Granted day:2018-04-19
Information query
IPC分类:
