公开(公告)号：US11682653B2

公开(公告)日：2023-06-20

申请号：US17180364

申请日：2021-02-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L23/544 ,  H01L21/56 ,  H01L27/146 ,  H01L23/31 ,  G06K9/00 ,  G06V40/13

CPC classification number: H01L24/96 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/31 ,  H01L23/315 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/544 ,  H01L24/13 ,  H01L27/1469 ,  H01L27/14618 ,  H01L27/14634 ,  H01L27/14636 ,  G06V40/1318 ,  G06V40/1329 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/13014 ,  H01L2224/1319 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13583 ,  H01L2224/13611 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/95001 ,  H01L2924/014 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00012

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US10545581B2

公开(公告)日：2020-01-28

申请号：US15726034

申请日：2017-10-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jen-Kai Ou ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Chih-Ming Hung

IPC: G06F3/02 ,  G06F3/041 ,  H01L41/053 ,  H01L41/23 ,  H01L41/319 ,  H01L41/293 ,  G06F3/01

Abstract: An electronic device includes a piezoelectric module, a sensing module and a buffer element. The piezoelectric module includes a substrate and a piezoelectric element. The substrate defines an opening penetrating the substrate. The piezoelectric element is disposed on the substrate and across the opening of the substrate. The sensing module is disposed over the piezoelectric module. The buffer element is disposed between the piezoelectric module and the sensing module.

公开(公告)号：US10937761B2

公开(公告)日：2021-03-02

申请号：US16709623

申请日：2019-12-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L27/146 ,  H01L23/544 ,  H01L23/31 ,  H01L21/56 ,  G06K9/00

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

公开(公告)号：US10242940B2

公开(公告)日：2019-03-26

申请号：US15655724

申请日：2017-07-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jung-Liang Yeh ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Chih-Ming Hung

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  G06K9/00 ,  H01L21/56

Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

公开(公告)号：US10522505B2

公开(公告)日：2019-12-31

申请号：US15918906

申请日：2018-03-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L27/146 ,  H01L21/56 ,  H01L23/31 ,  H01L23/544 ,  G06K9/00

Abstract: A surface mount structure includes a substrate, a sensor, an electrical contact and a package body. The substrate has a first surface and a second surface opposite to the first surface. The sensor is disposed adjacent to the second surface of the substrate. The electrical contact is disposed on the first surface of the substrate. The package body covers the first surface and the second surface of the substrate, a portion of the sensor and a first portion of the electrical contact.

公开(公告)号：US12272671B2

公开(公告)日：2025-04-08

申请号：US18212158

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih-Ming Hung ,  Meng-Jen Wang ,  Tsung-Yueh Tsai ,  Jen-Kai Ou

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/544 ,  H01L27/146 ,  G06V40/13

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.