Invention Grant
- Patent Title: Middle-of-line (MOL) metal resistor temperature sensors for localized temperature sensing of active semiconductor areas in integrated circuits (ICs)
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Application No.: US15246006Application Date: 2016-08-24
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Publication No.: US10247617B2Publication Date: 2019-04-02
- Inventor: Lixin Ge , Periannan Chidambaram , Bin Yang , Jiefeng Jeff Lin , Giridhar Nallapati , Bo Yu , Jie Deng , Jun Yuan , Stanley Seungchul Song
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: W & T/Qualcomm
- Main IPC: G01K7/01
- IPC: G01K7/01 ; G01K7/24 ; H01L21/3213 ; H01L21/768 ; H01L21/66 ; H01L23/528 ; H01L49/02 ; G01K7/18 ; H01L23/34 ; H01L23/522 ; H01L27/06

Abstract:
Middle-of-line (MOL) metal resistor temperature sensors for localized temperature sensing of active semiconductor areas in integrated circuits (ICs) are disclosed. One or more metal resistors are fabricated in a MOL layer in the IC adjacent to an active semiconductor area to sense ambient temperature in the adjacent active semiconductor area. Voltage of the metal resistor will change as a function of ambient temperature of the metal resistor, which can be sensed to measure the ambient temperature around devices in the active semiconductor layer adjacent to the metal resistor. By fabricating a metal resistor in the MOL layer, the metal resistor can be localized adjacent and close to semiconductor devices to more accurately sense ambient temperature of the semiconductor devices. The same fabrication processes used to create contacts in the MOL layer can be used to fabricate the metal resistor.
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