Invention Grant
- Patent Title: Busbar
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Application No.: US15866714Application Date: 2018-01-10
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Publication No.: US10249965B2Publication Date: 2019-04-02
- Inventor: Yutaro Okazaki , Akito Toyama , Shuhei Ejima
- Applicant: Yazaki Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, Ltd.
- Priority: JP2017-016298 20170131
- Main IPC: H01R11/28
- IPC: H01R11/28 ; H01M10/48 ; H01M2/10 ; H01M2/20 ; H01R4/18 ; H01M2/30

Abstract:
A busbar includes a plate-shaped body section and a wire connection section extended from the body section. The body section includes a first plate section, a second plate section, and a folding-back section connecting the first plate section and the second plate section. The first plate section and the second plate section are stacked mutually by folding-back the folding-back section. The first plate section has an outer shape that is positioned to a busbar accommodation section of a wire routing member made of insulation resin. A maximum width dimension of the second plate section in a direction parallel to the folding-back section is smaller than that of the first plate section in the direction parallel to the folding-back section.
Public/Granted literature
- US20180219309A1 Busbar Public/Granted day:2018-08-02
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