- 专利标题： Cooling mechanism and processing system
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申请号： US14401512申请日： 2013-05-02
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公开(公告)号： US10256128B2公开(公告)日： 2019-04-09
- 发明人: Keita Kumagai , Yoshiaki Sasaki , Hirohito Kikushima , Hayato Itomi
- 申请人： TOKYO ELECTRON LIMITED
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2012-112087 20120516; JP2012-273363 20121214
- 国际申请： PCT/JP2013/062764 WO 20130502
- 国际公布： WO2013/172209 WO 20131121
- 主分类号： F26B7/00
- IPC分类号： F26B7/00 ; H01L21/677 ; H01L21/67 ; H01L21/687 ; F24F13/02 ; H01L21/02 ; H01L21/68
摘要：
A cooling mechanism includes a plurality of support stands which is provided in a vertical direction over a plurality of stages in an atmospheric transfer chamber where a down-flow is formed, a plurality of support pins which is provided in each of the support stands and supports a target object in contact with the backside of the target object. The cooling mechanism further includes a plurality of air guide plates which is provided in the support stands and cools the target object supported by the support stand located at a lower stage using the down-flow.
公开/授权文献
- US20150133044A1 COOLING MECHANISM AND PROCESSING SYSTEM 公开/授权日：2015-05-14
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