Invention Grant
- Patent Title: Semiconductor devices and methods of forming the same
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Application No.: US15638387Application Date: 2017-06-30
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Publication No.: US10263064B2Publication Date: 2019-04-16
- Inventor: Chin-Yu Ku , Chien-Chih Chou , Chen-Shien Chen , Hon-Lin Huang , Chi-Cheng Chen , Kuang-Yi Wu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02 ; H01L23/00

Abstract:
Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor device includes an inductor structure, and the inductor structure is on a substrate and includes a first metal layer, a magnetic stack, a polymer layer and a second metal layer. The first metal layer is over the substrate. The magnetic stack is over the first metal layer and has a substantially zigzag shaped sidewall. The polymer layer is over the first metal layer and encapsulates the magnetic stack. The second metal layer is over the polymer layer.
Public/Granted literature
- US20190006455A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME Public/Granted day:2019-01-03
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