Invention Grant
- Patent Title: Electronic component including a material comprising epdxysilane-modified polyorganosiloxane
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Application No.: US15549136Application Date: 2016-02-04
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Publication No.: US10263164B2Publication Date: 2019-04-16
- Inventor: Christina Keith , Kathy Schmidtke , Klaus Hoehn
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
- Current Assignee Address: DE Regensburg
- Agency: McDermott Will & Emery LLP
- Priority: DE102015101748 20150206
- International Application: PCT/EP2016/052398 WO 20160204
- International Announcement: WO2016/124696 WO 20160811
- Main IPC: C08L83/00
- IPC: C08L83/00 ; C08G77/12 ; H01L33/56 ; C08G77/20 ; C08L83/04 ; C08K5/5435 ; H01L33/48
Abstract:
The present invention relates to an optoelectronic component comprising a semiconductor (1) and a polyorganosiloxane. The polyorganosiloxane is obtainable by crosslinking a composition comprising a first organosiloxane having at least one terminal vinyl group, a second organosiloxane having at least one silicon-hydrogen bond and an alkoxysilane having at least one epoxy group. Additionally specified is a method of producing an optoelectronic component.
Public/Granted literature
- US20180033927A1 ELECTRONIC COMPONENT INCLUDING A MATERIAL COMPRISING EPOXYSILANE-MODIFIED POLYORGANOSILOXANE Public/Granted day:2018-02-01
Information query
